The Forum – An Industry Knowledge Exchange

New at PACK EXPO Las Vegas 2019, The Forum offered attendees a unique, interactive learning experience. Free, 45-minute sessions on the latest industry trends included hands-on activities, small group discussions and Q&A sessions each day of the show.

Leading organizations that held interactive sessions at The Forum include:

• OpX Leadership Network
• Contract Packaging Association (CPA)
• Institute of Packaging Professionals (IoPP)
• The Organization for Automation and Control (OMAC)
• Robotic Industries Association (RIA)
• World Packaging Organization (WPO)
• PMMI University
• PMMI Business Intelligence

Seminar topics at recent PACK EXPO shows have included:

• Planning for Career Success in Packaging – There is a Road Map
• Understanding Overall Equipment Effectiveness and How to Calculate It
• Education & Workforce Development Best Practices
• Using Packaging Design to Enhance the Consumer Experience
• Standardizing Factory Acceptance Test Procedures