The Forum

The Forum – An Industry Knowledge Exchange

New at PACK EXPO Las Vegas 2019, The Forum offered attendees a unique, interactive learning experience. Free, 45-minute sessions on the latest industry trends included hands-on activities, small group discussions and Q&A sessions each day of the show.

Leading organizations that held interactive sessions at The Forum include:

  • OpX Leadership Network
  • Contract Packaging Association (CPA)
  • Institute of Packaging Professionals (IoPP)
  • The Organization for Automation and Control (OMAC)
  • Robotic Industries Association (RIA)
  • World Packaging Organization (WPO)
  • PMMI University
  • PMMI Business Intelligence

Seminar topics at recent PACK EXPO shows have included:

  • Planning for Career Success in Packaging – There is a Road Map
  • Understanding Overall Equipment Effectiveness and How to Calculate It
  • Education & Workforce Development Best Practices
  • Using Packaging Design to Enhance the Consumer Experience
  • Standardizing Factory Acceptance Test Procedures


Other PACK EXPO Shows

Available thru March 2021

Mexico City, MX

Las Vegas, NV USA

Philadelphia, PA USA

Guadalajara, MX

Chicago, IL USA